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Toshiba K2611 electronic transistor component with three metal leads for circuit applications
K2611 electronic transistor components with three metal pins from The Component Centre
K2611 silicon n-channel MOSFET datasheet from The Component Centre showing features and thermal characteristics
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Technical graphs and charts showing electrical characteristics for K2611 semiconductor by The Component Centre
Winsemi K2611B electrical characteristics and source-drain ratings datasheet page with detailed test conditions and values
Toshiba K2611 electronic transistor component with three metal leads for circuit applications
K2611 electronic transistor components with three metal pins from The Component Centre
K2611 silicon n-channel MOSFET datasheet from The Component Centre showing features and thermal characteristics
Technical drawing of K2611 transistor package dimensions from The Component Centre showing detailed measurements
Technical diagram and waveform for peak diode recovery test circuit featuring K2611 transistor by Winsemi
Winsemi K2611B semiconductor test circuits and waveforms schematic diagrams by The Component Centre
Technical datasheet showing graphs for K2611B electronic component performance variations and thermal response
Technical graphs and charts showing electrical characteristics for K2611 semiconductor by The Component Centre
Winsemi K2611B electrical characteristics and source-drain ratings datasheet page with detailed test conditions and values

K2611 900V 9A N Channel MOSFET

Sale price Rs.150.00
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Toshiba K2611 electronic transistor component with three metal leads for circuit applications
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Toshiba K2611 electronic transistor component with three metal leads for circuit applications

K2611 900V 9A N Channel MOSFET

Rs.150.00

K2611 900 V 9 A N‑Channel Power MOSFET – TO‑3PN Package

The K2611 (also known as 2SK2611) is a high-voltage N‑Channel MOSFET rated for 900 V drain‑source breakdown and 9 A continuous drain current at 25 °C. Designed with planar DMOS (π‑MOS III) technology, it delivers low on-state resistance (approximately 1.1 Ω at VGS = 10 V) and exhibits fast switching capabilities with gate charge around 58–72 nC depending on variant.

It handles 150 W power dissipation (Tc = 25 °C) and supports 27 A pulse current during avalanche conditions. The device includes robust protection features such as ±30 V maximum gate voltage and a junction temperature rating up to 150 °C.

Key Specs

Maximum Drain-Source Voltage (VDS): 900V Continuous Drain Current (ID): 9 A @ TC = 25 °C Single-Pulse Drain Current (IDM): 27 A Maximum Power Dissipation (PD): 150 W @ TC = 25 °C RDS(on) – Drain-Source On-Resistance: ~1.1 Ω @ VGS = 10V Gate Charge (Qg): 58–72 nC (typ.) Gate-Source Voltage (VGS max): ±30 V Maximum Junction Temperature (Tj max): 150 °C Thermal Resistance (Rθj‑c): ~0.833 °C/W, Rθj‑a: ~50 °C/W Package: TO‑3PN metal can with enhanced thermal dissipation

Features

Low RDS(on) (~1.1 Ω) for reduced conduction loss. Moderate gate charge (~58–72 nC) supports efficient switching. High-voltage rating (900 V) allows use in high-voltage switching circuits. Avalanche-tested up to 27 A pulse current for rugged performance. TO‑3PN package ensures excellent thermal handling under heavy load. Stable operation up to 150 ° C junction temperature. Gate-source tolerance up to ± 30 V enables compatibility with standard driver circuits.

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