IGCM20F60GA — CIPOS™ Mini 600 V / 20 A Intelligent Power Module
The IGCM20F60GA is a compact three-phase intelligent power module from Infineon, designed for motor control and low-power inverter applications. It combines reverse-conducting IGBTs with an integrated gate driver to provide low switching losses, surge capability, and built-in protection functions, suitable for variable-speed drives in appliances, HVAC systems, fans, and other motor control systems.
The module has a 600 V blocking voltage and a continuous output current rating of 20 A (15 A at elevated case temperature), with short-time peak capability up to 45 A. Its integrated features include bootstrap supply, under-voltage lockout, over-current shutdown (ITRIP), temperature monitoring (VFO/NTC), and cross-conduction prevention, which reduce the need for additional external components and improve system reliability. Recommended DC link operation and switching guidance help optimize performance in low-power motor and inverter designs.
From an integration perspective, the module provides low-side emitter pins for phase current sensing and lead-free terminals. Key thermal and electrical parameters include a junction temperature range of −40 °C to +150 °C, junction-to-case thermal resistance of approximately 3.84 K/W, and recommended PWM switching up to 20 kHz. These specifications make it suitable for compact motor drive designs where space, thermal management, and protection are important.
Key Specs
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Product family | CIPOS™ Mini — IGCM20F60GA |
| Voltage class (VCES) | 600 V |
| Rated output current | 20 A (TC = 25 °C); 15 A (TC = 80 °C) |
| Maximum peak output current (<1 ms) | ±45 A |
| Recommended DC link voltage (VPN) | 0 – 400 V (max surge 500 V) |
| Switching frequency (fPWM) | Recommended up to 20 kHz |
| Short-circuit withstand time | 5 µs (VDC ≤ 400 V, TJ = 150 °C) |
| Junction temperature range (TJ) | −40 °C … +150 °C |
| Power dissipation per IGBT | 32.6 W (typ.) |
| Thermal resistance, junction-to-case (RthJC) | ≈ 3.84 K/W |
| Package / Pins | Dual-Inline molded module, 24 pins (MDIP-24) |
| Integrated protections & features | Under-voltage lockout, over-current shutdown (ITRIP), temperature monitor (VFO/NTC), cross-conduction prevention, integrated bootstrap, accessible low-side emitters |
For more detailed information, please refer to the Infineon datasheet IGCM20F60GA Datasheet.
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