Home Pre-Cut Thermal Silicone Pads TE-P1 – 12 × 12 × 1.5 mm
Jar of blue Pre-Cut Thermal Silicone Pads square pieces for electronics heat transfer and cooling
Jar of blue Pre-Cut Thermal Silicone Pads on a table with several pads displayed and The Component Centre sign in background
Jar of blue Pre-Cut Thermal Silicone Pads in clear plastic container with white lid on counter
Jar of blue square Pre-Cut Thermal Silicone Pads in a clear jar on wood surface for electronics cooling
Jar of blue Pre-Cut Thermal Silicone Pads square pieces for electronics heat transfer and cooling
Jar of blue Pre-Cut Thermal Silicone Pads on a table with several pads displayed and The Component Centre sign in background
Jar of blue Pre-Cut Thermal Silicone Pads in clear plastic container with white lid on counter
Jar of blue square Pre-Cut Thermal Silicone Pads in a clear jar on wood surface for electronics cooling

Pre-Cut Thermal Silicone Pads TE-P1 – 12 × 12 × 1.5 mm

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Jar of blue Pre-Cut Thermal Silicone Pads square pieces for electronics heat transfer and cooling

Pre-Cut Thermal Silicone Pads TE-P1 – 12 × 12 × 1.5 mm

Rs.0.00

Pre-Cut Thermal Silicone Pads TE-P1 – 12 × 12 × 1.5 mm

The TE-P1 Pre-Cut Thermal Silicone Pads (12 × 12 × 1.5 mm) are designed to provide reliable heat transfer and protection in electronic assemblies. Made from soft silicone with good thermal conductivity, these pads help reduce thermal resistance between components and heatsinks. Their flexible structure allows them to fill surface gaps effectively, ensuring consistent contact and improved heat dissipation.

These pads are commonly used in power electronics, CPUs, GPUs, ICs, and other high-temperature components. They are also practical during soldering and rework, where they protect surrounding components from heat exposure. With their pre-cut size, they are simple to place and can be trimmed further if required.


Key Specs

Material: Thermal silicone (silica-based gel)
Dimensions: 12 × 12 × 1.5 mm (each pad)
Quantity per Box: 100 pads
Thermal Conductivity: High, with low thermal resistance
Mechanical Properties: Soft, flexible, cuttable, resistant to abrasion and oils
Applications: Heat transfer for ICs, CPUs, GPUs, VRMs, converters, and PCB assemblies; insulation during soldering and repair
Industry Use Cases: Power electronics, PCB repair, mobile device servicing, industrial equipment

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