DDB6U85N16L 1600V, 85A Diode Bridge Module
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DDB6U85N16L 1600V, 85A Diode Bridge Module
DDB6U85N16L Rectifier Diode Bridge Module
The DDB6U85N16L is a high-voltage, high-current rectifier diode bridge module designed for demanding power electronics applications. With a repetitive peak reverse voltage rating of 1,600 V and a continuous forward current of 85 A, this module offers strong performance under heavy load. It is built with Infineon’s eupec IsoPACK package technology, which combines robust thermal management and reliable construction.
Reliability has been engineered into DDB6U85N16L. It includes a DCB ceramic base plate for better heat dissipation, low forward voltage drop to reduce losses, and glass planar passivated chips for long life even under stress. It supports high thermal cycling, operates safely up to 150 °C, and can handle high surge currents. These features make it suitable for industrial and commercial systems that demand efficiency and durability.
Typical uses include three-phase diode rectification in motor drives, industrial inverters, power converters, battery chargers, and as free-wheeling diodes in switch-mode power supplies. Its module format (bridge configuration, 6 leads/pins), mechanical mounting style, and high isolation make it a suitable component where space, cooling, and reliability matter.
Key Specs
| Specification | Value / Description |
|---|---|
| Module Type | 3-Phase Rectifier Diode Bridge Module |
| Manufacturer | Infineon Technologies (eupec / IsoPACK) |
| Repetitive Peak Reverse Voltage (VRRM) | 1,600 V |
| Continuous Forward Current | 85 A |
| Package / Case | IsoPACK module, DCB ceramic base plate |
| Forward Voltage Drop (typical) | ~1.44 V under specified rated current |
| Surge Current Capability | High surge rating (forward surge current) for short intervals |
| Operating Temperature Range | −40 °C to +150 °C |
| Thermal-Cycling & Power Density | Good thermal dissipation via base plate; suitable for high power density |
| Isolation / Mounting | Bridge module with screw / panel mounting; high isolation to base plate |
| Package Size / Dimensions | Approx. 42 x 94 mm package (bridge module) |
| Forward Voltage Characteristic | Low Vf to reduce losses at rated current |
| Lifespan & Robustness | Glass passivated chips, suitable for long-term use under thermal and load stress |
